Micron-level pore size control: commonly used holesThe diameter range is from 10 μm to 1000 μ m to ensure  extremely high dimensional tolerances, the highest requirement can reach 1μm.

Anti-scattering cone hole design: to reduceThe small amount of electricity is scattered at the edge of the beam, and the micropores are set upThere are special angle openings, which are regularThere are 14°, 53°, 90° openingsTaper hole, which is the geometric shape of the workerStrict requirements.

The edges are extremely smooth: the hole wall is still thereIn the subtle burr or oxygenated layer, electricity will be inducedThe sub-beam charge response (Charging), which leads to image drift or distortion, Therefore, the smoothness of the edges of the hole wall is also alsoThere are extremely high demands.

A real "cold processing" case:Femtosecond excitation uses ultra-short pulse widths, in It is completed before the heat is transferred to the material matrixAblation. This completely solves the problem of cutting or drilling the materialThe edges that are often seen in the hole are blackened and oxygenatedTransformationand other heat damage problems.

3D rotary cutting and forming: with the help of precisionOptical rotation system, Yue Qian excites light not onlyExtremely consistent micron-level passesholes, which can be accurately reproduced at the microscopic scaleAnti-scattering cone holes of various morphology , ensure that the hole wall is round and burr-free.

Adaptability of all materials: high of courseMolybdenum and precious gold of hardness belong to platinum, or various types Special compound gold, ceramics, non-metal, etc. flyThe second irritation can realize stress-free cutting, which is accurate The strip diaphragm arranged in the micron level is large After the area is added, it still maintains the ultimate flatnessdegree.